ASROCK AMD RADEON RX 7900 GRE Challenger Series 16GB OC GDDR6 Graphics Card - 3 Yrs Wty

ASROCK AMD RADEON RX 7900 GRE Challenger Series 16GB OC Graphics Card - 3 Yrs Wty

(Overall performance comparable to 4070 Super, according to techpowerup. Along with the new AMD frame gen technology AFMF!!)

Clock: GPU / Memory

• Boost Clock*: Up to 2293 MHz / 18 Gbps

• Game Clock**: 1927 MHz / 18 Gbps

Key Specification

• AMD Radeon RX 7900 GRE GPU

• 16GB GDDR6 on 256-Bit Memory Bus

• 80 AMD RDNA 3 Compute Units (with RT+AI Accelerators)

• 64MB AMD Infinity Cache technology

• Microsoft DirectX 12 Ultimate

• PCI Express 4.0 Support

• 2 x 8-pin Power Connectors

• 3 x DisplayPort 2.1***, 1 x HDMI 2.1

Key Features

• Dual Fan Design

• Stylish Metal Backplate

• Striped Ring Fan

• Ultra-fit Heatpipe

• LED Indicator

• 0dB Silent Cooling

• Super Alloy Graphics Card

SPECIFICATIONS

- Graphics Engine : AMD Radeon RX 7900 GRE

- Bus Standard : PCI Express4.0 x16

- DirectX : 12 Ultimate

- OpenGL : 4.6

- Memory : GDDR6 16GB

- Engine Clock :

• Boost Clock : up to 2293 MHz

• Game Clock : up to 1927 MHz

- Stream Processors : 5120

- Compute Units : 80

- Memory Clock : 18Gbps

- Memory Interface : 256-bit

- Resolution : Digital Max Resolution: 7680x4320

- Interface :

• 1 x HDMI 2.1 (up to FRL 12Gbps)

• 3 x DisplayPort 2.1 with DSC (up to UHBR3 13.5Gbps)*

- HDCP : Yes

- Multi-view : 4

- Recommended PSU : 750W

- Power Connector : 2 x 8-pin

- Accessories : 1 x Quick Installation Guide

- Dimensions : 269 x 130 x 51 mm, 2.55-slot

- Net Weight : 985g

- Note :

• This model may not be sold worldwide. Please contact your local dealer for the availability of this model in your region.

• "Game Clock" is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.

• "Boost Clock" is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to:thermal conditions and variation in applications and workloads.